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Alva's Institute of Engineering & Technology

A Unit of Alva's Education Foundation(R), Moodubidire

(Affilliated to VTU, Belgaum, Approved by AICTE, New Delhi, Recognized by Govt. of Karnataka)

AIET Faculty

Dr. Satyanarayan

Mechanical Engineering

Google Scholar

Designation: Professor and Head
Qualification: B.E. M.Tech, Ph. D
Phone No: 08258- 262724 / 25
Email Id: aietmech08@aiet.org.in
Teaching Experience: 14 Years
Industry Experience: 2025 Years

Educational Details

UG
B.E, MEBEC, Bagalkot2004
PG
M.Tech, Materials EnggNITK Surathkal2009
Doctorate
Ph.D, Metallurgical & Materials EnggNITK Surathkal2014

Experience

  • 1Period (2013-2014)
    Mechanical Engineering
    AIET, Moodubidri - Senior Assistant Professor
  • 2Period (2014-2019)
    Mechanical Engineering
    AIET, Moodubidri - Senior Associate Professor
  • 3Period (2019-till date)
    Mechanical Engineering
    AIET, Moodubidri - Sr. Associate Professor and Head

1. Lead-Free Solders
2. Solidification and Mechanical Behavior of Solder Joints.
3. Mechanical Behavior Metals
4. Explosive welding
5. Thermal Interfacial Materials
6. Alloy Development

1. Non Convention Energy Systems (For P.G & U.G)
2. Engineering Drawing
3. Strength Of Materials/Mechanics Of Materials (SOM/MOM)
4. Material Science And Engineering
5. Foundry Technology
6. Mechanical Engg. Science
7. Biomass Energy Systems
8. Heat and Mass Transfer
9. Tribology
10. Additive Manufacturing

1. XRD Analysis
2. Scanning Electron Microscopic (SEM) Analysis
3. Failure Analysis
4. AutoCAD

 

International Publications (50+)
  1. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy, Advances in Colloid and Interface Science, 166 (2011) 87-118 (Impact Factor 19.3). Ranked 10th among the top 25 hottest articles by Science Direct, July to September 2011. Elsevier Publications.
  2. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, impact and tensile properties, Materials Science and Engineering A, 553 (2012), 64-70 (Impact Factor 7.0). Elsevier Publications.
  3. Spreading behaviour and evolution of IMCs during reactive wetting of SAC solders on smooth and rough copper substrates, Journal of Electronic Materials, 42(8) (2013) 2696-2707 (Impact Factor 2.5). Springer Publications.
  4. Wettability of Root Canal Sealers on Intraradicular Dentine Treated with Different Irrigating Solutions, Journal of Dentistry, 41(6) (2013), 556-560 (Impact Factor 5.5). Elsevier Publications.
  5. Welding of Sn and Cu Plates Using Controlled Underwater Shock Wave, Journal of Materials Processing Technology, Vol. 245, July 2017, Pages 300–308 (Impact Factor 7.5). Elsevier Publications.
  6. Weldability Windows for Underwater Explosive Welding of Sn and Cu Plates, Journal of Materials Processing Technology, Vol. 267, May 2019, pp. 152-158 (Impact Factor 7.5). Elsevier Publications.
  7. Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds, Journal of Materials Science: Materials in Electronics, 25(2), (2014) 864-872 (Impact Factor 2.8). Springer Publications.
  8. Review on Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications, Journal of Electronic Materials, 42(9) (2019) pp. 1-12 (Impact Factor 2.5). Springer Publications.
  9. Role of UV irradiated nafion in power enhancement of hydrogen fuel cells, International Journal of Hydrogen Energy, Vol 46, Issue 50, 2021, pp. 25596-2560 (Impact Factor 8.3). Elsevier Publications.
  10. Interpretable Ensemble Machine Learning Framework to Predict Wear Rate of Modified ZA-27 Alloy, Tribology International, Vol. 188, 2023, 108783 (Impact Factor 6.9). Elsevier Publications.
  11. The effect of interfacial morphology and weldability window on tin and aluminium plates welded plates using regulated water Shockwaves, Welding in the World, Vol. 68, 2941-2951, 12.09.2024 (Impact Factor 2.5). Springer Publications.
  12. Effect of Casting Moulds on Grain Morphology, Mechanical and Tribological Property of Sn-Cu Alloy, Bulletin of Materials Science, 48(52), 2025, 1-7 (Impact Factor 2.1). Springer Publications.

 

Patents
  • Patent Granted: Indian Patent No: 487817, Date of Grant: 22.12.2023, Application Number: 201941035383.
    Invention Title: “A Process for Enhancing Hydrogen Fuel Cells Performance Fuel Cells Performance With NAFION Proton Exchange Membrane Optimal”. (Date of Filing 03/09/2019)
  • Patent Granted: Indian Patent Design Application No: 416786-001, CBR Number: 208174, Design No: 416786-001, Date of Grant: 13.05.2024.
    Invention Title: “Alloy Testing Design”.

 

National Publications (5+)
1. Koushik N., Jameson Keisham, Avinash Poojary, Lathesh, Shankarappa Kalgudi, Pavithra G.P., Satyanarayan, “Electrochemical Etching on Copper Surfaces to Achieve Superhydrophobicity”, International Journal of Manufacturing and Materials Processing, Vol. 3, Issue 1, 2019, Page no. 1-6.

 

Books Edited
  • Editor (MJMP 2025): Material Joining and Manufacturing Publications (Materials Research Forum LLC, USA).
    Materials Research Proceedings Vol. 55, Publication 2025, 172 pages, print ISBN 978-1-64490-360-5 (release date June 2025), ePDF ISBN 978-1-64490-361-2.
    DOI: https://doi.org/10.21741/9781644903612 | https://mrforum.com/product/mjmp2025/
  • Editor (ICRAEM 2022): Materials Today: Proceedings (Elsevier Publications). Vol. 66, Iss. P4, pp.1571-2650, 2022, ISSN 2214-7853.
    ScienceDirect Link
  • Editor (iCOLD 2019): Materials Today: Proceedings (Elsevier Publications), Vol. 35, Iss. P3 (2021) 295–512.
    ScienceDirect Link
Research Projects
    • Photocatalytic Generation of Green Hydrogen and Development of Novel Low Cost, High-Performance Hydrogen Fuel Cell Stacks
      Awarded: March 2024 (as per JST), Funding: 62.7748 Lakhs (ongoing)
      Funding Agency: Central Power Research Institute (CPRI), Bangalore
      Scheme: Research Scheme on Power Sector (RSoP)
      Project Code: RSOP/21-26/GD/30 (Accounts Code: RSoP-AIETK-180, FAS Code: 727)
      Investigators: Dr. Satyanarayan, Dr. M. G. Anand Kumar, Dr. Jayarama A, Dr. Richard Pinto

 

    • Formation of Nanostructured Aluminum Surfaces for Realizing Superhydrophilicity Using Nd:YAG Laser
      Awarded: February 2021, Funding: 12 Lakhs
      Funding Agency: VTU Research Grants Scheme
      Grant Reference: VTU/BGM/Aca/A-12/VTU RGS/GIS-ME/2021-22/5862/17
      Research Institution: Alvas Institute of Engineering and Technology
      Principal Investigator: Dr. Satyanarayan
      Co-investigator: Dr. Jayarama A

 

  • A Study on Effects of Thermal Aging on Microstructure and Microhardness of Lead Base and Lead Free Solder/Substrate Interfacial Regions – An Attempt for Replacement of Pb in Electronic Applications
    Awarded: May 2025, Funding: 20 Lakhs (ongoing)
    Scheme: Karnataka Fund for Infrastructure Strengthening in Science & Technology Level 1 (K-FIST L1)
    Funding Agency: Vision Group on Science and Technology (VGST), Government of Karnataka, Bengaluru
    Principal Investigator: Dr. Satyanarayan
    Co-Principal Investigator: Dr. Suresh P S

   INTERNATIONAL CONFERENCES ORGANIZED

  • Chair (Editor, Material Research Forum LLC, USA) for the
    “International Symposium on Recent Advances in Materials Joining and Manufacturing Processes (MJMP)”
    held on 27th and 28th February, 2025. Organized by the Dept. of Mechanical Engineering,
    Alva’s Institute of Engineering and Technology, Moodbidri, India in association with Institute of Industrial Nanomaterials (IINa), Kumamoto University, Japan & BETA CAE System India Pvt. Ltd, Bangalore, India.
    (https://alvas-mechanical.netlify.app/)
  • Co-Chair (Guest Managing Editor, Elsevier) for the
    “The International Conference on Recent Advances in Engineering Materials (ICRAEM – 2022, Online)”
    held during 03 – 05 March 2022. Organized by the Departments of Mechanical Engineering and Basic Sciences of
    Alva’s Institute of Engineering and Technology (AIET).
    (https://www.aiet.org.in/events/icraem-2022/)
  • Organizer (Treasurer, Guest Managing Editor, Elsevier) for the
    “International Conference on Laser Deposition: Nanostructures, Heterostructures and 2D layers (iCOLD)”
    in association with the Indian Institute of Technology Madras (IITM), held from November 27-29, 2019. Mijar, Moodbidri, India.
    (https://www.aiet.org.in/events/icold-2019-international-conference/)
  • Organizer for the 6th
    “International Symposium on Explosion, Shock wave and High Strain-rate Phenomena (ESHP)”
    held from 19-21 March 2019, Puducherry, India.
    (Conference Document)
International : Organised 1, Attended 1
National : Organised 5, Attended 10